The solution uses a low-latency, high-bandwidth memory physical layer (PHY) with a 2.5-D package based on the FX-14 ASIC design system,
Today announced the 2.5D package solution, demonstrating its capabilities for the high-performance 14nm FinFET FX-14ASIC integrated circuit design system.
The 2.5D ASIC solution includes silicon substrate integration technology for breakthrough lithography limitations and two terabits (2Tbps) multi-channel HBM2 PHYs developed in collaboration with Rambus. Based on the success of the 14nm FinFET, the solution will be integrated into the next generation of FX-7 ASIC design systems based on the Grid 7nm FinFET process.
"With the tremendous advances in interconnect and packaging technology in recent years, the boundaries between wafer processing and packaging have been blurred." Kevin O'Buckley, vice president of product development for cell core ASICs, said, "Incorporating the 2.5D package into ASIC designs can not only be enhanced "This is the result of the natural evolution of our technology, which enables us to provide our customers with the support from product design to manufacturing and testing in a one-stop, end-to-end manner."
Rambus memory PHYs are targeted at high-end network and data center applications that perform data-intensive tasks in systems that require low latency and high bandwidth. The PHY is compatible with the JEDEC JESD235 HBM2 standard and supports data rates up to 2Gbps per pin, resulting in a total bandwidth of 2Tbps.
"We are committed to providing comprehensive HBM PHY technology that enables data center and network solution providers to meet today's most demanding mission requirements and take advantage of huge market opportunities." Rambus Vice President and General Manager, Memory and Interface Division Luc "In our partnership with the grid, we have combined our HBM2 PHY with the grid's 2.5D package and the FX-14 ASIC design system to provide a fully integrated solution for the industry's fastest growing application," said Seraphin. "
The FX-14 and FX-7 experience with FinFET technology in the production of FinFET technology is a complete set of ASIC design solutions. The program includes functional modules based on the industry's broadest and most extensive combination of intellectual property (IP), which spawned the next generation of wired / 5G wireless networks, cloud / data center servers, machine learning / deep neural networks, Aerospace / defense applications unique solutions. Grid is one of only two companies in the world that offers state-of-the-art IP and advanced memory and packaging solutions.