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Gloriafeld Launches 7-nanometer Special Application Integrated Circuit Platform For Data Center, Machine

GLOBALFOUNDRIES announces the introduction of its FX-7 ™ ASIC (Application Specific Integrated Circuits) using a 7nm FinFET process. The FX-7 is an integrated design platform that combines state-of-the-art process technology with differentiated intellectual property rights and 2.5D / 3D packaging technology to deliver the industry's most complete portfolio of data centers, machine learning, automotive, wireline communications and 5G wireless applications s solution.


With the continued success of the FX-14, the FX-7 offers a full range of customized interface intellectual property rights and differentiation, including high-speed SerDes (60G, 112G), with industry-leading 56G SerDes technology and special dedicated integrated circuit expertise Storage solutions that cover low-power SRAM, high-performance embedded TCAM, integrated DACs / ADCs and ARM processors, as well as advanced packaging options such as 2.5D / 3D. In addition, the FX-7 product group can be used for low-power and high-performance applications represented by very large data centers, 5G networks, machines and deep learning applications, providing new design methods and complex ASIC solutions The In the future, the FX-7 is expected to be used in solutions that support automotive ADAS and image applications.


"With our explosive growth in data traffic and bandwidth on the global network, our customers are continually proposing new requirements," said Mike Cadigan, Senior Vice President, ASIC Business Unit, GLOBALFOUNDRIES ASIC. With our state-of-the-art 7LP FinFET process technology, FX-7 products Providing customers with the most advanced low-power, high-performance ASIC solutions for emerging customers such as data centers, high computing, wireless networks, and so on to continually enhance our image as a leader in customer service.


"Thanks to GLOBALFOUNDRIES 'expertise in manufacturing silicon wafers with IBM's pre-semiconductor technology business, GLOBALFOUNDRIES' 7nm FinFET process technology demonstrates its advanced technology and market leadership," said Jim McGregor, Founder and Principal Analyst, TIRIAS Research "Through its latest FX-7 ASIC product, GLOBALFOUNDRIES extends its business footprint from traditional foundry customers to next-generation systems, which are seeking to apply cutting-edge wafer process technology to the next generation of 5G networks from the depth of artificial intelligence Road and other broad areas.


FX-7 ASIC product design software is now ready, is expected to achieve mass production in 2019.